Modelling and thermal analysis of advanced insulating layer electronic applications

Klarmann, Steffen, Vagapov, Yuriy and Gotzig, Heinrich (2018) Modelling and thermal analysis of advanced insulating layer electronic applications. In: 24th International Workshop on Thermal Investigations of ICs and Systems THERMINIC-2018, 26-28 September 2018, Stockholm, Sweden.

GURO 388_Therminic2018 KVG.pdf - Accepted Version

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This paper proposes the replacement of a conventional Insulating-Metal-Substrate (IMS) dielectric layer with an electroconductive adhesive which is applied onto a treated aluminium heat sink. The adhesive based structure results in a lower thermal resistance of the system compared to IMS based on Aluminium. The model covers the investigation of two IMS structure with a Copper conductor layer with a thickness of 200μm, a dielectric layer of 50μm with different thermal conductivities and an Aluminium base layer with a thickness of 920μm. However, the IMS is placed onto a 100 x 100 x 33 mm Aluminium heat sink. The investigated adhesive based structure consists of the same Aluminium heat sink treated with an oxidation layer with a thickness of 50μm and an adhesive conductor layer with 30μm thickness. Furthermore, the use of forced convection to reduce the junction temperature of all three models is also considered.

Item Type: Conference or Workshop Item (Paper)
Divisions: Applied Science, Computing and Engineering
Depositing User: Hayley Dennis
Date Deposited: 25 Feb 2019 14:00
Last Modified: 25 Feb 2019 14:00

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