Forced air cooled heat sink with uniformly distributed temperature of power electronic modules

Bünnagel, Christian, Monir, Shafiul, Sharp, Andrew, Anuchin, Alecksey, Durieux, Olivier, Uria, Ikeya and Vagapov, Yuriy (2021) Forced air cooled heat sink with uniformly distributed temperature of power electronic modules. Applied Thermal Engineering, 199 (117560). ISSN 1359-4311

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The paper discusses an approach to the design of the forced air-cooling heat sink for power electronic application to uniformly distribute the temperature of the semiconductor modules fixed on the top of the heat sink. The proposed approach suggests a minor modification of a conventional fin-based heat sink commonly manufactured for cooling of power electronic modules. Following the proposed modification, an air guide plate having a V-shaped cut is attached to the bottom of the heat sink to redistribute the airflow through the fins. To verify the proposed approach, the modified forced air-cooling system for a power electronic circuit comprising of three IGBT modules was modelled and numerically simulated using Ansys Fluent software under steady-state conditions. The numerical analysis was conducted for a range of power loss 50–100 W in each IGBT module and an airspeed of 5 m/s through the heat sink. The simulation results have shown a good uniform distribution of the temperature across the IGBT modules where the temperature difference does not exceed 0.21 °C.

Item Type: Article
Keywords: Power Electronics, Heat Sink, Forced Air Cooling, Uniform Temperature Distribution, Air Guide Plate, Semiconductor Reliability, Semiconductor Lifetime
Divisions: Applied Science, Computing and Engineering
Depositing User: Hayley Dennis
Date Deposited: 21 Sep 2021 12:10
Last Modified: 21 Sep 2021 12:10

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